1 sheet no.: d1-a01601en date march 30, 2007 ?sharp corporation PT100MF1MP1 PT100MF1MP1 phototransistor notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the la test device specification sheets before usin g any sharp device. features 1. mountable by both top view and side view smd package 2. plastic mold with resin lens 3. sensitive (darlington phototransistor) 4. mold with visible light cut resin 5. lead free and rohs directive component agency approvals/compliance 1. compliant with rohs directive (2002/95/ec) 2. content information about the six substances specified in ?management methods for control of pollution caused by electronic information prod- ucts regulation? (popular name: china rohs) (chinese: ); refer to page 9 applications 1. office automation equipment 2. audio visual equipment 3. home appliances 4. telecommunication equipment 5. measuring equipment 6. tooling machines 7. computers
sheet no.: d1-a01601en 2 PT100MF1MP1 outline dimensions do not wire in this area 1. unspecified tolerance: 0.2 mm 2. dimensions in parenthesis are shown for reference 3. area: au plating 4. 5. resin burr are not included in outline dimensions 6. package: black (visible light cut-off epoxy resin) 7. unit: mm (center of lens) side view (from pcb) top view (from pcb) collector notes: terminal connection 3.0 2.8 0.75 0.65 (0.4) 1.5 2.2 (1.0) (1.0) 2.2 1.0 0.4 (0.2) (0.35) 0.95 1.5 (0.70) (0.57) (0.92) 3.0 3.0 r0.8 1.4 1.7 0.85 1.1 1.1 1.1 1.5 1.1 1.5 12 1 2 1 2 emitter no. pin arrangement name
sheet no.: d1-a01601en 3 PT100MF1MP1 absolute maximum ratings * 1 10 s (max.) see reflow profile on page 8. electro-optical charactertistics * 1 ee: illuminance by cie standard light source a (tungsten lamp) parameter symbol rating unit collector-emitter voltage v ceo 35 v emitter-collector voltage v eco 6v collector current i c 20 ma collector power dissipation p c 75 mw operating temperature topr -30 to +85 c storage temperature tstg -40 to+ 95 c soldering temperature *1 tsol 240 c parameter symbol conditi ons *1 min. typ. max. unit collector current i c ee = 0.01 mw/cm 2 , v ce = 5 v 0.2 ? 1.2 ma dark current i ceo ee = 0, v ce = 10 v ? ? 1.0 a collector-emitter saturation voltage v ce(sat) ee = 1 mw/cm 2 , ic = 0.8 ma ? ? 1.0 v collector-emitter breakdown voltage bv ceo i c = 0.1 ma, ee = 0 35 ? ? v emitter-collector breakdown voltage bv eco i e = 0.01 ma, ee = 0 6 ? ? v peak sensitivity wavelength p ? ? 860 ? nm response time (rise) tr v ce = 2 v, i c = 5 ma, rl = 100 ? 400 2,000 s response time (fall) tf ? 300 1,500 s half intensity angle ? ??15? (ta = 25c) (ta = 25c)
sheet no.: d1-a01601en 4 PT100MF1MP1 fig. 1 collector po wer dissipation vs. ambient temperature fig. 2 spectral sensitivity 8 0 75 70 60 50 40 30 20 15 10 0 -25 0 25 am b ient temperat u re ta (c) collector po w er dissipation pc (m w ) 50 75 8 5100 8 0 100 60 40 20 0 400 500 600 700 8 00 900 1,000 1,100 w a v elength (nm) relati v e sensiti v ity (%) ta = 25c fig. 3 radiation diagram -30 -20 -10 0 +10 +20 ta = 25c -40 -50 -60 -70 - 8 0 -90 +30 +40 +50 +60 +70 + 8 0 +90 0 ang u lar displacement relati v e radiant intensity (%) 20 40 60 8 0 100
sheet no.: d1-a01601en 5 PT100MF1MP1 package specification fig. 4 tape sh ape and dimension fig. 5 reel shape and dimension 4.0 0.1 2.0 0.05 4.0 0.1 1. 8 0.1 2.45 0.1 0.3 0.05 5.5 0.1 5 3.5 0.05 8 .0 0.3 1.75 0.1 3.3 0.1 1.5 +0.1 -0 1 8 0.0 note: units are in mm 11.4 1 2.0 0.5 13.0 0.2 9.0 +0.3 -0 60.0 +1 -0
sheet no.: d1-a01601en 6 PT100MF1MP1 taping specification 1. see fig. 4 for the tape structure and dimensions. the carrier tape structure incorporates a cover tape thermally bonded to it to protect the parts against electrostatic damage. 2. see fig. 5 for the reel structure and dimensional information. 3. see fig. 6 for the product insert direction. the collector terminal is at the hole side of the tape. packing specifications packaging method 1. seal the aluminum laminated bag and includ the ru led tape-reel and humidity indicator card quantity. 2. fill in the label a nd paste on the bag. 3. put the moisture-proof laminated bag in the ruled case. fig. 6 production i nsertion direction name material quantity aluminum laminated bag aluminum pholyethylene refer to packaging method label paper (filled in by factory) ? humidity indicator card paper (filled in by factory) 1 sheet/reel package shape product quantity moisture-p roof bag quantity tape = reel ( 180 mm) 1 ch type 1,500 pcs/reel 1 reel/bag p u ll-o u t direction
sheet no.: d1-a01601en 7 PT100MF1MP1 manufacturing guidelines storage and handling 1. store these parts between 5c and 30c, at a relative humidity of less than 70 % . 2. after breaking the package seal, maintain the environment within 5c to 25c, at a relative humidity of less than 60 % , and mount the parts within two days. 3. when storing the parts after breaking the seal, sharp recommends storage of no longer than two weeks in a dry box or by resealing the parts in a moisture-proof bag with a desiccant. 4. when baking the parts before mounting, sharp recommends no more than one incidence of baking, performed with the parts either temporarily mounted or on a metal tray. do not bake the parts in the carrier tape. bake the parts at 125c, for 16 to 24 hours. cleaning instructions 1. confirm this device's resistance to process chemicals be fore use, as certain process chemicals may affect the optical characteristics. 2. solvent cleaning: solvent temperature should be 45c or below. immersion time should be 3 minutes or less. 3. ultrasonic cleaning: the effect upon devices varies d ue to cleaning bath size, ultrasonic power output, cleaning time, pcb size and device mounting circumstances. sharp recommends testing using actual production condi- tions to confirm the harmlessness of the ultrasonic cleaning methods. 4. recommended solvent materials: ethyl alcohol, methyl alcohol, and isopropyl alcohol.
sheet no.: d1-a01601en 8 PT100MF1MP1 soldering instructions 1. when using solder reflow methods, follow the time and temperature profile shown below. sharp recommends sending parts through this process only once. 2. if using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the part?s resin. be sure to keep the heat profile within the guidelines shown in figure above. 3. do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. internal connections may be severed due to mechanical force placed on the pack- age due to the pcb flexing during the soldering process. 4. sharp recommends checking the soldering process to ensure these guidelines are followed. max max 240c 200c 165c 1 ~ 4c/s 1 ~ 4c/s 1 ~ 4c/s 120 s max. 10 s max. 60 s max. 90 s max. 25c
sheet no.: d1-a01601en 9 PT100MF1MP1 presence of odcs (rohs compliance) this product shall not contain the following materials, and they are not used in the production process for this product: ? regulated substances: cfcs, halon, carbon tetrachlor ide, 1,1,1-trichloroethane (methylchloroform). specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ? lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). ? content information about the six substances specified in ?management methods for control of pollution caused by electronic informatio n products regulation? (chinese: ) note: ? indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the conc entration limit requirement as described in sj/t 11363-2006 standard. category toxic and hazdardous substances lead (pb) mercury (hg) cadmium (cd) hexavalent chromiun (cr 6+ ) polybrominated biphenyls (pbb) polybrominated diphenyl ethers (pbde) infrared emitting diode ??????
important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp?s devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristi cs, data materials, struc- ture, and other contents described herein at any time without notice in order to im prove design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment (terminal) --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to en sure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliabilty such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability an d safety such as: --- space applications --- telecommunication equipment (trunk lines) --- nuclear power control equipment --- medical and other life support equipment (e.g. scuba) if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. sheet no.: d1-a01601en 10 PT100MF1MP1
|
